Call for Applications: International Exchanges Schemes 2022 offered by Royal Society (Deadline: 15 June 2022)

International Exchanges Schemes offered by the Royal Society are now calling for applications. The schemes provide funding support for visits to stimulate collaborations between scientists in the UK/US and overseas, including Hong Kong. Both schemes cover a number of disciplines within natural sciences, including but not limited to biological research, chemistry, engineering, mathematics and physics. The application deadline for both schemes is 15 June 2022.

(A) Kan Tong Po Visiting Fellowships Programme

The programme aims to contribute at the highest level of scientific research and education at a group of universities in Hong Kong, including CUHK. It provides funding support for a one-off visit from (a) either UK/US to Hong Kong; or (b) Hong Kong to either UK/US.

  • Award Amount: Max. £3,000
  • Visit Duration: Up to three months
  • Scope of Support: Club class or economy class international airfare and subsistence

For more information, please visit here.


(B) International Exchanges Scheme – Standard Programme

The programme offers funding support for a one-off visit or bilateral visits between scientists in the UK and overseas to stimulate new collaborations.

  • Award Amount and Visit Duration:
    • £3,000 for a one-off visit of one week to three months
    • £6,000 for multiple bilateral visits to be completed within one year
    • £12,000 for multiple bilateral visits to be completed within two years
  • Scope of Support: Travel, associated subsistence for the visit(s) and research expenses

For more information, please visit here.

Applications must be initiated by a lead applicant based in the UK/US. Please submit your application online by 15 June 2022 15:00 UK Time through the Royal Society’s Grants and Awards management system.

For enquiries, please contact The Royal Society by email at Applicants are advised to send a copy of their application(s) to the Office of Academic Links (c/o Ms. Alice Leong; for record.

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